When parts of a component need to be sealed to protect against external influences or for screening, potting is the first choice.
At KÖPP you can choose from a huge range of hardnesses from gel to the Shore D range, different materials, and single or dual-component systems, polyurethane, silicone, MS polymer or epoxy resin. You can also have black, semi-translucent and translucent systems that conduct electricity and heat.
Programmable robot equipment guarantees you bubble-free potting. This makes air pockets a thing of the past.
Single-component and dual-component systems have become established for the dam-and-fill method.
With this method a circuit board can be provided with a high-viscosity or thixotropic seal around the edge in the first step, which then acts as a dam for the fill (potting).
The simpler potting applications are used for a wide range of purposes, e.g.:
We also offer programmable application of high-viscosity systems directly to the component. High-precision dosing is also possible.